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RF and Microwave Microelectronics Packaging
Language
English
English
Book
Paperback
This book presents the latest developments in packaging for high-frequency electronics. Topics inclu...
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Libristo code: 09062257
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394 b
394 b
160.89
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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.§
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About the book
Full name
RF and Microwave Microelectronics Packaging
Author
Sean S. Cahill, Franklin Kim, Ken Kuang
Language
English
English
Binding
Book - Paperback
Date of issue
2014
Number of pages
285
EAN
9781489983244
ISBN
9781489983244
Libristo code
09062257
Publishers
Springer-Verlag New York Inc.
Weight
468
Dimensions
155 x 235 x 16
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