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RF and Microwave Microelectronics Packaging
Language
English
English
Book
Hardback
This book presents the latest developments in packaging for high-frequency electronics. Topics inclu...
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Libristo code: 01420531
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444 b
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This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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About the book
Full name
RF and Microwave Microelectronics Packaging
Author
Ken Kuang, Franklin Kim, Sean S. Cahill
Language
English
English
Binding
Book - Hardback
Date of issue
2009
Number of pages
285
EAN
9781441909831
ISBN
1441909834
Libristo code
01420531
Publishers
Springer-Verlag New York Inc.
Weight
594
Dimensions
165 x 242 x 23
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