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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Language
English
English
Book
Paperback
This volume encompasses the latest, innovative methods of testing three-dimensional integrated circu...
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Libristo code: 13816997
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This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
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About the book
Full name
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author
Brandon Noia, Krishnendu Chakrabarty
Language
English
English
Binding
Book - Paperback
Date of issue
2016
Number of pages
245
EAN
9783319345345
ISBN
3319345346
Libristo code
13816997
Publishers
Springer International Publishing AG
Weight
4524
Dimensions
155 x 235 x 11
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