Check order status

Become part of a community of book lovers from all over the world and get access to a whole bunch of benefits. Create an account for free

Austrian Post 5.49 € DPD courier 3.99 € DPD point 2.99 € GLS courier 4.99 €

Contact

How to shop

Help

My account

▸ Empty :-(

Solder Joint Reliability Assessment

Name: Solder Joint Reliability Assessment
Brand: Springer International Publishing AG
SKU: 01468797
Price: 107.29 EUR
Availability: InStock
Author: Mohd N Tamin
ISBN: 9783319000916

Finite Element Simulation Methodology

Mohd N Tamin

Norhashimah M. Shaffiar

Language

English

Book Hardback

Libristo code: 01468797

Publishers Springer International Publishing AG, April 2014

This book presents a systematic approach in performing reliability assessment of solder joints using... Full description

Libristo code: 01468797

263 b

107.29 € VAT included

In stock at our supplier Shipping in 10-13 days

Delivery to Austria

Up to 30 days for returns

Customers also purchased

Čarovný les plný hier neuvedený autor

Paperback

4.69 €

Коханою стати легко Ð¡Ð•Ð Ð“Ð†Ð˜ Ð–Ð£Ð ÐÐ’Ð›Ð¬ÐžÐ’

Adobe ePub DRM

2.79 €

Contes envoûtants de l'Égypte millénaire Billy

Paperback

24.89 €

PEYGAMBERI?MI?ZI?N Sallallahu aleyhi vesellem U?MMETI? U?ZERI?NDEKI? HAKKI - The Rights of Prophet Muhammad -peace be upon him- over his Nation Yahya Bin Musa Alzahrani

Paperback

26.59 €

The Magic Flute - Das Vermächtnis der Zauberflöte, 1 DVD Florian Sigl

DVD

14.99 €

Anyám titkos könyve Müller Péter

Hardback

15.19 €

Son excellence eugene rougon Émile Zola Book

Paperback

9.89 €

Melpoména v okovech? - Povahokresba ve francouzské tragédii 17. století Záviš Šuman

Paperback

14.29 €

Historie vom Erzvater Jacob und seinen zwoelf Soehnen nonymus

Paperback

24.50 €

Pazifistisch und Altruistisch Karl-Heinz Ignatz Kerscher

Paperback

52.95 €

Materialien und Kopiervorlagen zu Hans Peter Richter 'Damals war es Friedrich' Tanja Kraus

Paperback

19.89 €

Obra poética (1946 LUIS

Paperback

22.99 €

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.