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Nanoparticle Engineering for Chemical-Mechanical Planarization
Language
English
English
Book
Hardback
Explains the physicochemical properties of nanoparticles according to each step in the chemical mech...
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Libristo code: 06708211
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Explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP and noble metal CMP. This work also presents design techniques using polymeric additives to improve CMP performance.
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About the book
Full name
Nanoparticle Engineering for Chemical-Mechanical Planarization
Author
Jea-Gun Park
Language
English
English
Binding
Book - Hardback
Date of issue
2009
Number of pages
224
EAN
9781420059113
ISBN
9781420059113
Libristo code
06708211
Publishers
Taylor & Francis Inc
Weight
570
Dimensions
156 x 234 x 20
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