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Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms...
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Libristo code: 06506804
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520 b
520 b
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Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
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About the book
Full name
Mems/Moem Packaging
Author
K.B. Gilleo
Language
English
English
Binding
Book - Hardback
Date of issue
2005
Number of pages
220
EAN
9780071455565
ISBN
9780071455565
Libristo code
06506804
Publishers
McGraw-Hill Education - Europe
Weight
474
Dimensions
159 x 237 x 23
Categories
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