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Materials Reliability in Microelectronics V: Volume 391

Language EnglishEnglish
Book Hardback
Book Materials Reliability in Microelectronics V: Volume 391 William F. Filter
Libristo code: 02060054
Publishers Materials Research Society, October 1995
This long-standing proceedings series is highly regarded as a premier forum for the discussion of mi... Full description
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This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.

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About the book

Full name Materials Reliability in Microelectronics V: Volume 391
Language English
Binding Book - Hardback
Date of issue 1995
Number of pages 523
EAN 9781558992948
ISBN 1558992944
Libristo code 02060054
Weight 886
Dimensions 157 x 234 x 33
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