Contact
How to shop
Delivery
Shopping guide
English
290 b
Delivery to Austria
Up to 30 days for returns
Customers also purchased
/
Paperback
52.19
€
/
Paperback
22.99
€
/
Paperback
93.59
€
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.§The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes. §This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.
About the book
English
Give this book today
It's easy
1 Add to cart and choose Deliver as present at the checkout 2 We'll send you a voucher 3 The book will arrive at the recipient's addressYou might also be interested in
/
Paperback
15.39
€
/
Paperback
11.79
€
/
Paperback
13.49
€
/
Paperback
10.69
€
/
Paperback
39.69
€
/
Paperback
33.59
€
/
Paperback
5.79
€
Hi! I'm Libroamiko, your book advisor.
How can I help you?