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Hybrid Assemblies and Multichip Modules
Language
English
English
Book
Hardback
Offering a description of design considerations from the user's viewpoint, this reference discusses...
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Libristo code: 06696303
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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.
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About the book
Full name
Hybrid Assemblies and Multichip Modules
Author
Fred W. Kear
Language
English
English
Binding
Book - Hardback
Date of issue
1992
Number of pages
296
EAN
9780824784669
ISBN
9780824784669
Libristo code
06696303
Publishers
Taylor & Francis Inc
Weight
635
Dimensions
156 x 234 x 17
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