Contact
How to shop
Delivery
Shopping guide
High Frequency Interconnect Characterization and Modeling
For VLSI On-Chip Interconnects and RF Package Wire Bonds
English
156 b
Delivery to Austria
30-day return policy
Customers also purchased
/
Adobe ePub DRM
3.99
€
/
Paperback
42.59
€
/
Paperback
27.89
€
/
Paperback
26.69
€
/
Paperback
88.39
€
Continuous scaling of transistors combined with§increased chip area results in the ratio of global§wire delay to gate delay increasing at a super-linear§rate. Simple RC models have become inadequate for§simulation of VLSI circuits. In addition, parasitic§inductance and capacitance of IC packages impose§limits on the circuit performance at RF frequencies.§This book presents modeling of on-chip inductance for§chips with ground grids that emulate those used in§real circuits. S-parameter characterization of test§chips up to 10 GHz shows good agreement with§simulation and analytical calculations. On-chip 3-D§capacitance modeling capabilities for arbitrarily§shaped objects are also presented. In addition, an§approach to fast 3-D modeling of the geometry for§bonding wires in RF circuits and packages is§demonstrated. The geometry and an equivalent circuit§are presented to model the frequency response of§bonding wires. Excellent agreement between modeled§results and measured data is achieved for frequencies§up to 10 GHz. The book should be useful to the§semiconductor professionals in academia and industry,§who are interested in the on-chip and package§interconnects researches.
About the book
English
Give this book today
It's easy
1 Add to cart and choose Deliver as present at the checkout 2 We'll send you a voucher 3 The book will arrive at the recipient's addressYou might also be interested in
/
Paperback
51.99
€
/
Paperback
8.89
€
/
Hardback
24.59
€
/
Paperback
15.39
€
Hi! I'm Libroamiko, your book advisor.
How can I help you?