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Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language
English
English
Book
Paperback
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods use...
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Libristo code: 05181543
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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.§
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About the book
Full name
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author
John W. Balde
Language
English
English
Binding
Book - Paperback
Date of issue
2014
Number of pages
347
EAN
9781461349778
ISBN
146134977X
Libristo code
05181543
Publishers
Springer-Verlag New York Inc.
Weight
569
Dimensions
155 x 235 x 21
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