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Advanced Ta-Based Diffusion Barriers for Cu Interconnects
Language
English
English
Book
Paperback
Copper has become the standard metallisation material for on-chip interconnects in high-performance...
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Libristo code: 06423929
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Copper has become the standard metallisation material for on-chip interconnects in high-performance microprocessors. This book intends to carry out microstructure and functional property investigations for advanced, high-performance Tabased diffusion barriers before and after annealing to compare their thermal stabilities.
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About the book
Full name
Advanced Ta-Based Diffusion Barriers for Cu Interconnects
Author
Rene Hubner
Language
English
English
Binding
Book - Paperback
Date of issue
2009
Number of pages
102
EAN
9781604564518
ISBN
9781604564518
Libristo code
06423929
Publishers
Nova Science Publishers Inc
Weight
192
Dimensions
153 x 227 x 8
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